Smart card Contactless chip module 330um

The contactless smart card module with a height (maximum) of only 330 microns (0.33mm) meets the standard specifications of international smart card chip manufacturers such as NXP (MOA4), STMicroelectronics (CB4), Infineon, etc.

Relying on years of experience in the semiconductor industry, Chilitag Technology continues to develop ultra-thin technology, and has been able to produce high-efficiency and high-yield contactless smart card modules with a height (maximum) of only 330 microns (0.33mm), which is in line with the international smart card chip size. Manufacturers such as NXP (MOB6), STMicroelectronics (CB6), Infineon and other standard specifications, over the years have provided international customers with contactless smart card module packaging services, reaching more than tens of millions each year.

Contactless smart card modules are mainly used for cards and passports, and can also be applied to other non-contact smart card module solutions, such as chips + antennas (RFID) for transportation tickets, tags, wristbands and even livestock tags. The contactless smart card module is used for identification, authentication or tracking.

The contactless smart card module production plant meets the relevant ISO international certification requirements, ROHS and other international material specifications. The contactless smart card module packaging service can provide one-stop service, from wafer to final Contactless Chip Module's fully customized service.

Detail Specification

1.1  .Lead frame

1.2  Chip adhesive

1.3  Bond wire

1.4  Encapsulation